Webinar by TI “MagPack™ technology: 3 steps ahead with new power modules’ power density, efficiency, and EMI”

07/31/2024

Fitting more of your functionality into a smaller space, and overcoming the associated thermal challenges of doing so, demands that TI power modules achieve previously-impossible levels of performance.

The innovative MagPack™ technology fully utilizes all 3 dimensions (height, width, and depth) to provide best-in-class power density, superior efficiency, and reduced EMI emissions—all in a thermally effective, easy-to-use, overmolded package. Come learn about this new, cost-effective technology to take your industrial, enterprise, or communications equipment application to the next level.

Presenting several newly released MagPack technology modules, you will learn:

• The power density improvements realized today
• The increased efficiency and reduced thermal challenges possible
• The measured EMI reduction through MagPack technology’s shielding
• How easy-to-use MagPack technology is and why it’s right for your system

Date: August 8, 2024.

Learn more and register.

www.ti.com