Keysight Joins TSMC Open Innovation Platform 3DFabric Alliance

05/05/2023

Keysight Technologies, Inc. has joined the TSMC Open Innovation Platform® (OIP) 3DFabric Alliance, which was formed recently by TSMC to accelerate 3D integrated circuit (IC) ecosystem innovation and readiness. The Alliance focuses on achieving rapid implementation of silicon and system-level innovations that enable next-generation compute and mobile applications using TSMC's 3DFabric™ technologies.

3DFabric Alliance membership gives Keysight access to the TSMC 3Dblox™ standard, enabling the development of electronic design automation (EDA) software and testing solutions. Keysight will have access to 3DFabric technologies to optimize its design tools and design workflows to accelerate 3D IC designs. In addition, Keysight will collaborate with TSMC on test and measurement methodologies, ensuring the quality and reliability of 3D IC designs.

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