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The entire world of embedded systems at electronica 2012
11/01/2012 | 1424
From November 13 – 16, electronica 2012 will present the entire range of hardware and software in the sector for embedded platforms – from industrial PCs and industrial control units to software-debugging solutions and entire development tools for microcontrollers. In addition, the first embedded platforms conference will be held on November 14 and 15. Besides how to select the best embedded modules, the conference will answer fundamental questions about choosing components and system design. Together with the exhibition and the forum, the conference rounds out the three-pillar concept for the embedded sector.

Anritsu Develop MT8820C Radio Communication Analyzer to Support Evaluation of Band22/Band42/Band43 LTE Mobiles
10/31/2012 | 1816
The MT8820C now supports the new LTE FDD Band22 and LTE TDD Band42/43 frequencies used by LTE smartphones and mobiles,as part of a complete LTE, W-CDMA/HSPA, CDMA2000Ⓡ, TD-SCDMA, & GSM test solution.

Agilent Technologies Expands Wireless Test Portfolio by Completing Acquisition of AT4 Wireless Test Systems Business
10/29/2012 | 1630
Agilent Technologies Inc. announced that AT4 wireless' Test Systems business assets are now part of Agilent.

Agilent Technologies Introduces 14 FieldFox Handheld Analyzers that Deliver Benchtop Accuracy, MIL-spec Durability to Field Applications
10/26/2012 | 1538
Agilent Technologies Inc. announced 14 FieldFox handheld analyzers that deliver benchtop-instrument accuracy in field-test environments. Designed for harsh conditions and hard-to-reach locations, FieldFox analyzers cover satellite communications, microwave backhaul, military communications, radar systems and a wide range of additional applications.

LabVIEW 2012 Accelerates Success and Improves the Scalability of Measurement and Control Systems
10/24/2012 | 1495
LabVIEW 2012 Provides recommended application architectures designed to save time, ensure scalability and lower maintenance costs; includes stability improvements and environment enhancements derived directly from customer feedback designed to increase productivity; supports a large portfolio of new hardware products showcasing NI’s commitment to expanding platform capabilities and enabling cutting-edge systems.

STA-61 Sync Tester Updates
10/22/2012 | 1611
Spectracom released version 1.9 of the product's firmware. This update package is available through the public web site. It is recommended to update all fielded units with this upgrade.

PAN1321i Series from Panasonic
10/19/2012 | 1644
Introducing the NEW PAN1321i Series Bluetooth RF Module compatible with Apple devices such as the iPod®, iPhone® and iPad®.

The R&S ESR, the world's fastest EMI test receiver, reduces testing times and more reliably detects EMI
10/17/2012 | 1628
Rohde & Schwarz introduces the new R&S ESR EMI test receiver whose broadband architecture allows standard-compliant EMI measurements up to 6000 times faster than other solutions. Comprehensive diagnostic tools such as spectrogram display, realtime spectrum analysis and IF analysis help developers detect and eliminate EMI. The R&S ESR is impressively easy to use thanks to its intuitive touchscreen interface.

Agilent Technologies Announces Industry's First True USB Coaxial Switch
10/15/2012 | 1602
Agilent Technologies Inc. announced a USB-powered, single-pole double-throw coaxial switch, operating from DC to 18 GHz. The first-to-market microwave switch driven by a USB port, the Agilent U1810B will provide system-design and manufacturing engineers a long-operating-life solution with convenient RF switching.

New EEH-ZA & EEH-ZC Series. Hybrid Surface Mount Aluminum Electrolytic Capacitors
10/12/2012 | 1715
Panasonic Electronic Components, a worldwide leader in Capacitor Products, is pleased to announce the NEW EEH-ZA and EEH-ZC Series Hybrid Surface Mount Aluminum Electrolytic Capacitors. These two NEW Hybrid Capacitor Series take the benefits of both electrolytic and polymer capacitor technologies and combine them, producing a capacitor with low ESR, low leakage current, high ripple current and smaller case sizes. These combined benefits save valuable board space, enhance overall board performance and lower design costs.


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