Industry news

The Consumer Electronics Association (CEA)® announced that the 2013 International CES® is the largest in the show's 45+ year history, with 1.92 million net square feet of exhibit space. The previous record was 1.86 million net square feet of space at the 2012 International CES. More than 3,250 exhibitors unveiled some 20,000 new products at the 2013 CES, drawing more than 150,000 attendees, including more than 35,000 from more than 170 countries outside the United States. Owned and produced by CEA, the 2013 International CES is the world's largest annual innovation event and concluded on Friday, Jan.11.

The R&S®ESR EMI Test Receiver has been named one of the “100 Hot Products of 2012” by UBM Tech’s EDN. The 2012 EDN Hot 100 highlights the electronics industry’s most significant products of the year based on innovation, significance, usefulness, and popularity.

The 2013 International CES® opened its doors featuring more than 3,250 exhibitors across 1.9 million net square feet of exhibit space, breaking both space and exhibitor records that were set last year. Innovation propelled this year’s preshow press events that kicked off with 74 companies showcasing their latest tech at CES Unveiled on Sunday night, and nearly 30 exhibitors launching new products during CES Press Day. Owned and produced by the Consumer Electronics Association (CEA)®, the 2013 International CES, the world’s largest annual innovation event, opens today and runs through Friday, January 11 in Las Vegas, Nevada.

Samsung's Flexible Displays, Brand Matters' Experts and Best of CES Awards Highlight Day Two And Three of 2013 CES President Clinton addresses how mobile devices can bridge the global divide; FCC Announces Initiative to Improve Wi-Fi Congestion.

International Expo CES, January 8 2013. Here at CES 2013, AKTAKOM has unveiled new technologies for Web and Android applications in AKTAKOM measuring devices. Among innovative devices exhibited are APS-7305L – finalist in Power supply category of the competition held by “Test & Measurement World” magazine – and ATE-9538 with AKTAKOM Environment Measurement A software.

The NI WSN-3214 strain/bridge completion node features hardware-timed waveform acquisition and is ideal for wireless structural health monitoring of bridges, buildings and equipment. With expanded voltage range, faster sampling rates and higher integrated electronic piezoelectric (IEPE) excitation, the NI 9232 C Series module is a data acquisition card optimized for industrial accelerometers, tachometers and proximity probes in condition monitoring applications.

Innovation meets policy at the Consumer Electronics Association’s (CEA)® Innovation Policy Summit at the 2013 International CES®. The summit will host discussions from top government officials and representatives from startups and established consumer electronics companies to highlight the relationship between groundbreaking products and technology policies at the 2013 CES, the world’s largest innovation event, January 8-11, 2013, in Las Vegas. Speakers include representatives from the U.S. Congress, Federal Trade Commission (FTC), Google and Verizon as well as the Chairman and all four Commissioners from the Federal Communications Commission (FCC).

Agilent Technologies Inc. announced the U1273AX OLED handheld digital multimeter, which can operate in temperatures as low as -40 C. Even in such frigid conditions, the new handheld DMM provides accurate results with no warm-up time required.

Anritsu Company announces the industry’s first call-based LTE Advanced Carrier Aggregation testing capability that can be integrated into its MD8430A LTE Signalling Tester. The software-only upgrade leverages the four available RFs in the MD8430A, and provides 300 Mb/s downlink throughput using two 2x2 MIMO Component Carriers (CCs). When configured with this option, the MD8430A can test advanced wireless devices at twice the rate available on today’s most advanced LTE networks.

The 2013 International CES® will unveil the latest wireless technologies and trends across the mobile connected universe, including advancements in accessories, the cloud, e-books, embedded technology, smartphones and tablets, through a series of keynote addresses, supersessions, conference tracks and TechZones dedicated to future trends in wireless technology.

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